Umthombo wokukhanya we-COB nomthombo wokukhanya we-LED, yimuphi ongcono?

Umthombo wokukhanya kwe-Cob kanye nomthombo wokukhanya we-LED yimuphi ongcono?

Isibani sivame kakhulu empilweni yethu, ngokuthuthuka kwesayensi nobuchwepheshe, kunezinhlobo eziningi ezintsha zokukhanyisa.banamafuction amaningi, futhi banezinhlobo eziningi zemithombo yokukhanya.Umthombo wokukhanya we-CoB yiwona omele kakhulu.Umthombo wokukhanya we-Cob ungumthombo wokukhanya ohlanganisiwe osebenza kahle kakhulu ohlangene, oxhunywe ngokuqondile ku-chip eholelekile esibukweni sensimbi yesibuko esinezinga eliphezulu lokukhanyela, futhi ayinayo i-electroplating, i-reflow welding kanye nenqubo ye-SMT, ngakho-ke izindleko zomthombo wokukhanya we-COB aphansi kakhulu.Kodwa kukhona abangani abaningi abangajwayelene kakhulu nomthombo wokukhanya we-COB, ngakho-ke ake ngikutshele ngolwazi lomthombo wokukhanya we-COB.

Uyini umthombo wokukhanya kweCob

Umthombo wokukhanya we-COB uwubuchwepheshe bomthombo wokukhanya obuphezulu obuhlanganisiwe obusebenza kahle kakhulu obunamathisela ngokuqondile i-chip ye-LED esibukweni sensimbi esingaphansi esinezinga eliphezulu elikhanyayo.Lobu buchwepheshe buqeda umqondo wokubakaki, futhi abunayo i-electroplating, i-reflow welding kanye nenqubo ye-SMT.Ngakho-ke, inqubo yehliswa cishe ngengxenye eyodwa kwezintathu futhi izindleko nazo zilondolozwa ngokukodwa kokuthathu.

Umthombo wokukhanya kwe-Cob imikhiqizo eyinhloko

Kunezindlela ezimbili eziyinhloko zobuchwepheshe be-Chip ezingenalutho: ubuchwepheshe be-COB kanye nobuchwepheshe be-Flip Chip.I-Chip on board packaging (COB), ukunikezelwa kwe-semiconductor chip enamathiselwe ebhodini lesifunda PRINTED, uxhumano lukagesi lwe-chip kanye ne-substrate lwenziwa ngendlela ye-lead suture, futhi lumbozwe nge-resin ukuze kuqinisekiswe ukwethembeka.

Inqubo yokukhiqiza umthombo wokukhanya kwesikhwebu

Inqubo ye-Chip On Board (COB) iwukumboza indawo yokubeka i-silicon wafer nge-thermal conductive epoxy resin (ngokuvamile isiliva doped epoxy resin) Ngaphezulu kwe-substrate, bese ubeka isicwecwana se-silicon ngqo Phezu kwe-substrate, ukwelashwa kokushisa kuze kube yilapho i-wafer ye-silicon igxilile ngokuqinile Ku-substrate.Khona-ke i-wire welding isetshenziselwa ukusungula uxhumano oluqondile lukagesi phakathi kwe-silicon wafer kanye ne-substrate.

light source

Umthombo wokukhanya kwe-Cob kanye nomthombo wokukhanya we-LED yimuphi ongcono?

I-LED yendabuko: "Idivayisi yokukhanya yomthombo wokukhanya we-LED →Imojula yomthombo wokukhanya we-MCPCB → izibani ze-LED", ikakhulukazi ngenxa yokuthi azikho izingxenye zomthombo wokukhanya eziwumgogodla ezifanele, hhayi nje kuphela ezidla isikhathi, kodwa futhi nezindleko eziphezulu.

 

Iphakheji "Imodyuli yomthombo wokukhanya we-COB → isibani se-LED", ingapakisha ngokuqondile ama-chips amaningi ebhodini lesekethe eliphrintiwe le-MCPCB, ngokusebenzisa ukuchithwa kokushisa okuqondile kwe-substrate, yonga izindleko zokupakisha ze-LED, izindleko zokukhiqiza imojula ye-optical injini kanye nezindleko zokusabalalisa ukukhanya kwesibili.Mayelana nokusebenza, imojuli yomthombo wokukhanya we-COB ingagwema ngempumelelo izithiyo ezifana nokukhanya kwamabala kanye nokucwayiza okukhona ekuhlanganisweni kwamadivayisi omthombo wokukhanya ahlukahlukene ngokuklama okunengqondo nokubumba ama-microlens.Ukunikezwa kombala komthombo wokukhanya kungathuthukiswa ngempumelelo ngokungeza inhlanganisela efanele yama-chips abomvu ngaphandle kokunciphisa kakhulu ukusebenza kahle nempilo yomthombo wokukhanya.

Izinzuzo ezihlobene yilezi:

Inzuzo yokusebenza kahle kwezokukhiqiza

Inqubo yokukhiqiza yokupakisha iyafana naleyo yenqubo yokukhiqiza ye-SMD yendabuko.Ukusebenza kahle kwe-PACKAGING ngokuyisisekelo kuyafana nalokho kwe-SMD kunqubo ye-crystal eqinile kanye nomugqa wokushisela.Kodwa-ke, ukusebenza kahle kokupakishwa kwe-COB kuphakeme kakhulu kunokwemikhiqizo ye-SMD ezicini zokukhipha, ukuhlukanisa, ukuhlukanisa nokupakisha.Izindleko zokupakishwa kwe-COB zabasebenzi nezokukhiqiza zibalelwa ku-10% wezindleko zempahla, kusetshenziswa ukupakishwa kwe-COB, izindleko zabasebenzi nezokukhiqiza kungonga u-5%.

Umthombo wokukhanya

k-cob

K-COB LIGHT SOURCE

Ukupakishwa kwe-SMD yomdabu kusebenzisa uhlobo lwamapetshi ukunamathisela izingxenye eziningi ezihlukene kumabhodi e-PCB ukuze kwakhe izingxenye zomthombo wokukhanya zezinhlelo zokusebenza ze-LED.Le ndlela inezinkinga zokukhanya kwamabala, ukuxhopha nokuphuma kokukhanya.Iphakheji ye-K-COB iyiphakheji ehlanganisiwe, engumthombo wokukhanya ongaphezulu, ene-Engeli enkulu yokubuka kanye nokulungiswa okulula, okunciphisa ukulahlekelwa kwe-refraction yokukhanya.Ukunikezwa kombala komthombo wokukhanya kungathuthukiswa ngempumelelo ngokungeza inhlanganisela efanele ama-chips abomvu ngaphandle kokunciphisa kakhulu ukusebenza kahle nempilo yomthombo wokukhanya.

k-cob structure

Okungenhla ukwabelana nawe ngolwazi oluyisisekelo lomthombo wokukhanya we-COB, ngithemba ukuthi ungawuqonda kangcono umthombo wokukhanya we-COB ngokwabelana kwethu.Umthombo wokukhanya we-K-cob, othuthukiswe futhi wakhiqizwa inkampani yethu - SFUJIAN CAS-CERAMICS OPTOELECTRONICS Co.,Ltd.

I-K-COB ingaqondwa kalula njengomthombo wokukhanya ongaphezulu ohlangene wamandla aphezulu, futhi isici sayo esikhulu kunazo zonke izindleko eziphansi, kulula ukuyisebenzisa, ukunqanyulwa kokushisa nokukhanya kungokwesayensi kakhulu, ngakho umthombo wokukhanya we-K-COB uqashelwa kakhulu yiwo wonke umuntu.Futhi manje iningi lomthombo wokukhanya osetshenziselwa ukukhanyisa umthombo wokukhanya we-COB, ongenawo umphumela omuhle wokukhanyisa, kodwa futhi usindisa amandla.


Isikhathi sokuthumela: Mar-29-2022
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